iemens Simcenter FloTHERM 是一款先进的热管理软件，用于进行电子产品的热仿真和优化。它由西门子公司开发，旨在帮助工程师设计和分析电子设备的热传导和热分布，以确保其在正常运行条件下的可靠性和性能。
FloTHERM 提供了一套强大的工具和功能，使工程师能够准确模拟电子产品中的热传导和热行为。它使用计算流体动力学（CFD）技术，考虑了空气流动、传热和温度分布等因素，以预测设备中的热问题并进行优化。
该软件提供直观的用户界面和易于使用的建模工具，使工程师能够快速构建电子设备的几何模型，并设置材料属性、电子元件和边界条件。FloTHERM 还支持导入CAD文件，以便直接使用现有的设计数据。
FloTHERM 提供了准确的热分析和仿真结果，包括温度分布、热流、热阻和热传导路径。工程师可以使用这些结果来识别潜在的热问题、改进散热方案、优化电子元件的布局和冷却系统设计。
Siemens Simcenter FloTHERM 的功能
瞬态热分析
Simcenter Flotherm 支持对电子设备和产品进行准确的瞬态分析。它甚至能够在亚微秒时间尺度上模拟瞬态事件。您可以对各种不同的瞬态行为进行建模，例如组件中与时间相关的功率耗散和瞬态恒温控制建模，其中模型输入随监视的温度而变化。这些功能支持电力电子应用的功率循环建模、消费设备运行功率模式转换、风扇控制冷却以及评估功率降额和热缓解策略。
强大的网格划分
利用易于使用的 Simcenter Flotherm 瞬时可靠网格化，让您专注于热设计。稳健的结构化笛卡尔方法对于典型电子设备的网格划分稳定且数值高效。它进一步针对快速网格生成和迷你动画化解决方案时间进行定制，通过局部网格控制在需要时获得更精细的分辨率。基于 SmartPart 或对象关联的网格生成的价值在于它会立即自动更新，从而无需在连续研究中的方向或位置更改几何体时完全重新网格化。
BCI-ROM技术
边界条件独立降阶模型 (BCI-ROM) 技术为电子产品的快速瞬态热分析提供了优势，其速度比全 3D CFD 快几个数量级，同时保持精度。Simcenter Flotherm 能够根据传导分析提取 BCI-ROM，保持预测准确性，但在演示案例中求解速度提高了 40,000 多倍。降阶模型的“边界条件独立”方面非常有价值，因为这使 BCI-ROM 能够在任何热环境中使用，同时保持准确性。BCI-ROM 可以以多种格式导出：作为 Mathworks Matlab Simulink 等工具求解的矩阵，以 VHDL-AMS 格式用于电路仿真工具，如 Siemens EDA PartQuest 和 Xpedition AMS 以支持电热分析，
File size: 1.0 GB
FloTHERM uses advanced CFD techniques to predict airflow, temperature, and heat transfer in components, boards, and complete systems, including racks and data centers. It’s also the industry’s best solution for integration with MCAD and EDA software.FloTHERM is the undisputed world leader for electronics thermal analysis, with a 98 percent user recommendation rating. It supports more users, application examples, libraries and published technical papers than any competing product.
资源特色
Accelerated Thermal Design Workflow
FloTHERM integrates with popular MCAD and EDA tools. Its XML import capability simplifies building and solving models, post-processing results automatically. FloTHERM’s automatic sequential optimization and DoE capabilities reduces the time it takes to reach optimized design, allowing it to be deeply embedded in the design flow.
Robust Meshing and Fast Solver
FloTHERM lets engineers focus on design, delivering the most accurate results possible within engineering timescales. Its SmartParts and structured-Cartesian method offers the fastest solution time per grid cell. The FloTHERM “localized-grid” technique supports integrally matched, nested, non-conformal grid interfaces between different parts of the solution domain.
Usability and Intelligent Thermal Models
Integral model checking in FloTHERM lets users see which objects have attached material, the power attached to every object, and corresponding assembly-level power dissipation. It also identifies whether the object is creating a mesh line.
FloTHERM SmartParts represent ICs to full racks of electronics from a large list of suppliers, streamlining model creation to minimize solve times and maximize solution accuracy.
Thermal Characterization and Analysis from Component to System
Combine FloTHERM with T3Ster transient thermal characterization for thermal simulation of real-world electronics. Since reliability of components can decrease exponentially due to heat problems, using T3Ster lets manufacturers design chips, ICs, and PCBs of superior thermal performance. They can also publish reliable thermal data for downstream applications.
Now FloTHERM can convert a simulated transient thermal response into a structure function curve using the same mathematical process utilized by T3Ster. These structure function curves are known to correlate with the physical structure of the device, and are thus the ideal platform to compare simulation results with actual test data. FloTHERM’s Command Center now provides automated calibration of the package thermal model to match the T3Ster results, ensuring the correct thermal response irrespective of the length of the power pulse. Equipment manufacturers and systems integrators can now use calibrated models to design even more reliable products, avoiding thermally-induced failures throughout the product’s lifetime.
